Dr. Randhir Thakur is senior vice president and the president of Intel Foundry Services, reporting to Intel CEO Pat Gelsinger. Under Thakur’s leadership, Intel Foundry Services is leading the development and growth of Intel’s new foundry business, a significant element of Intel’s IDM 2.0 strategy. His organization will bring Intel’s leading-edge process and packaging technology, broad IP portfolio and committed capacity to serve foundry customers. Thakur’s team is focused on building a world-class service organization with a strong focus on technology innovation and operational excellence. In addition, Thakur will continue in his role as chief supply chain officer.
Thakur joined Intel in 2017, bringing 30 years of experience as a hands-on innovator and business leader with expertise in global manufacturing, research and development, and profitable P&L management. Thakur joined Intel as corporate vice president of Global Supply Management, expanding his role to chief supply chain officer in 2020. His deep expertise in global semiconductor manufacturing, ecosystem leadership, process technology equipment and customer orientation are critical to the success of Intel Foundry Services.
Previously, he served as executive vice president of the silicon systems group at Applied Materials Inc., leading the company’s semiconductor business. Prior to that role at Applied Materials, he led the company’s flat-panel display and solar business. Before rejoining Applied Materials in 2008, Thakur served as executive vice president at SanDisk Corp., where he was responsible for NAND design technology and fabrication operations, and where he also led worldwide operations and supply chain. He initially joined Applied Materials in 2000 and spent his first five years in leadership roles in the semiconductor product groups. He has served in many business and technical leadership roles across the semiconductor industry, including roles at Steag Electronic Systems and Micron Technology Inc.
Thakur earned a bachelor’s degree in electronics and telecommunications engineering from the National Institute of Technology, Kurukshetra, in India; a master’s degree in electrical engineering from the University of Saskatchewan in Canada; and a Ph.D. in electrical engineering from the University of Oklahoma. He was named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013 and has made seminal contributions to the semiconductor industry. He holds more than 300 patents.