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Intel unveils its flagship 3rd generation Xeon Scalable data centre chip

8 April 2021
1614
2 min.
10
Intel unveils its flagship 3rd generation Xeon Scalable data centre chip

New chip with artificial intelligence

Intel on Tuesday unveiled its "new scalable chip with embedded artificial intelligence", the 3rd generation Xeon Scalable, which can be used in local servers, peripheral computing devices, data centres and 5G networks. Intel has shipped more than 200,000 of these new chips to cloud computing companies, Cisco, Dell, Lenovo and others.

Intel (INTC) on Tuesday unveiled its new 3rd generation Xeon Scalable processors (codenamed "Ice Lake"), which are 10-nanometer scalable processors for use in data centres, hybrid clouds, 5G networks and peripheral computing devices.

According to Intel, the new chips deliver an average 46 per cent improvement in performance on popular data centre workloads over the previous Ice Lake generation.

The new Intel chips will have up to 40 processing cores embedded in a single silicon and will also be able to access much more memory, an important factor for server performance, the company said.

Intel said it has sold more than 200,000 test units of its 3rd generation Xeon Scalable processors in the first quarter of 2021.

Customers include the world's leading cloud service providers and more than 15 major telecommunications equipment manufacturers and communications service providers, as well as global computer system manufacturers.

The new 3rd generation Ice Lake chips have already been applied by companies such as HPE (HPE), Cisco (CSCO), Dell Technologie (DELL), Lenovo and Supermicro in their new products servers, supercomputers and computing peripherals.

Navin Shenoy, executive vice president and general manager of the data platforms group at Intel described the 3rd generation Xeon processor as "the most flexible and productive scalable platform" in the company's history.

He said: "Intel is uniquely positioned in terms of architecture, design and manufacturing". "Verizon Communications (VZ) plans to use the new Ice Lake chips. A representative from Verizon appeared at Intel's presentation, along with representatives from Microsoft (MSFT), Oracle (ORCL) and others", Shenoy added.

Persons1 and Companies9 in the news

Executive Vice President of Intel
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Supermicro
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Lenovo
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Dell
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Cisco
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Intel
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Microsoft
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Oracle
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