Description
ACM Research develops, manufactures and sells wet cleaning and other equipment used to improve the manufacturing process and yield for integrated chips. The Company markets and sells its wet-cleaning equipment under the brand name Ultra C, based on the Company's Space Alternated Phase Shift (SAPS), Timely Energized Bubble Oscillation (TEBO), and Tahoe technologies.
These tools are designed to remove random defects from a wafer surface, without damaging the wafer or its features. It has designed these tools for use in fabricating foundry, logic and memory chips, including dynamic random-access memory (DRAM) and 3D NAND-flash memory chips.
It also develops, manufactures and sells a range of packaging tools to wafer assembly and packaging customers.
