Description
Intel Foundry Services offers a wide range of manufacturing services to meet your unique product needs, including Intel's industry-leading sort and test capabilities.
Intel’s advanced packaging techniques allow integration of diverse computing engines across multiple process technologies with performance parameters similar to a single die, but with a platform scope that far exceeds the die-size limit of single-die integration. Intel® embedded multi-die interconnect bridge (EMIB) and Foveros are advanced 2D and 3D packaging technologies that are delivering high performance.
As a global leader in research and development (R&D) and manufacturing, Intel invests tens of billions of dollars on R&D, while driving advancements in leading edge semiconductor technology. This provides an opportunity to optimize and deliver industry-leading platform solutions with our customers for every existing and evolving market segment.
